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What materials are suitable for low-temperature hot melt adhesive particles? A list of bonding scenarios

2026-08-14    Views: 12    Chinese

Answer directly

low temperatureHot melt adhesive granulesSuitable for materials that are sensitive to heat and prone to deformation, with a melting temperature of about 110-130 ℃, it can complete bonding at lower temperatures, avoiding substrate burns, shrinkage, or wrinkling.

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Applicable Material List

  • Film and flexible packaging:PE, PP film, aluminum foil composite layer, high temperature will shrink, low temperature adhesive is more friendly.
  • Thermal paper:Copperplate paper, self-adhesive surface material, and photo paper should avoid bubbling and curling.
  • Plastic parts:PET, PVC, ABS small parts, reduce deformation at low temperatures.
  • Electronic accessories:Wire harness fixation and foam bonding to prevent component failure due to heat.
  • Thin fabrics and non-woven fabrics:Medical dressings and filter mesh fitting.

Key selection points

Confirm the upper limit of substrate temperature resistance and select the one that matches the opening time and production efficiencyHot melt adhesive granulesFor those with high requirements for adhesive strength, priority should be given to Sunlife’s low-temperature and high adhesion series of hot melt adhesives. Guangzhou Sunlife Trading can provide specific model recommendations based on material samples.

Frequently Asked Questions

Q: Is the low-temperature adhesive firm?Suitable substrates are fully sufficient, the key is to match the opening time and pressing timing.

Q: Can it be mixed with regular glue?It is not recommended to mix them, as different melting points can easily cause delamination.

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