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The ‘exposed adhesive root’ refers to the part of the book spine (top or bottom) that is not covered by paper and directly shows the exposed adhesive layer after cutting three sides of the adhesive book.It is not the same as “insufficient glue layer (empty glue)”, “uneven book back edges”, and “surface glue overflow” – the latter are problems with the thickness, shape, or surface of the entire spine, while the exposed glue root is a local appearance defect at the edge of the incision where the glue is more than the paper and has been cut. Readers can see yellow or transparent adhesive strips on both ends of the spine of the book at a glance, which affects the appearance and grade.
Let’s explain how it is generated, how to investigate, and how to avoid it.

Many people mistake exposed glue roots for overflowing glue, but there are actually two things:
Simple judgment: Open the book and look at the top/bottom cut. If there is a clear glue mark and the glue feels protruding or concave compared to the paper surface, it is basically an exposed glue root.
It is difficult to “repair” the partially exposed glue roots of the already cut book perfectly. The common method is:
the key isDon’t scratch hard on the finished productScratching the paper fibers is more obvious.

More than 90% of the exposed adhesive root is due to equipment and process parameter issues, not the adhesive itself. Sunlife will provide recommended values for adhesive layer thickness and milling back hair according to your paper, machine speed, and book thickness when using hot melt glue for books and periodicals. It also supports sending samples, making samples on the machine, and determining the process based on the actual cutting effect. The specific amount of glue and temperature are as followsConclusion of accompanying process card and sampleBased on experience, do not rely on hard estimation.
Explanation: This article only provides an investigation and explanation of common appearance defects in wireless adhesive packaging for books and periodicals. The specific adhesive layer thickness, milling depth, and cutting parameters are subject to the conclusions of the accompanying process card and sample; Not to extend unverified statements such as’ all products have passed a certain test ‘.
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