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High temperature resistant hot melt adhesive for books and magazines is mainly based on polyamide resin, so high temperature resistant hot melt adhesive is also known as polyamide hot melt adhesive. Polyamide resin is a linear thermoplastic resin with a large number of repeated amide groups on the molecular main chain. Compared with other thermoplastic resins, a significant feature of it is that the melting and solidification of the resin occur within a narrow temperature range during heating and cooling. What are the main components of high-temperature resistant hot glue for books and periodicals?
This feature enables polyamide hot melt adhesive to quickly solidify after heating, melting, and coating during the construction process. It also gives it good adhesive properties at temperatures close to the softening point.
Due to the presence of hydrogen on the amide group of polyamide resin, it can form strong hydrogen bonds with the electron donating carbonyl group of another amide group, thereby increasing the melting point of the resin and thus having good flexibility. The oil resistance and adhesion performance increase with the increase of resin molecular weight. Compared with ethylene vinyl acetate copolymer hot melt adhesive, polyamide hot melt adhesive has a higher softening point and therefore has better heat resistance.
The molecular weight of polyamide resin used as a hot melt adhesive matrix for high-temperature resistant books and periodicals is usually in the range of 1000-9000. The polyamide resin used as a hot melt adhesive matrix is mainly composed of dimers of unsaturated fatty acids (such as linoleic acid, soybean oleic acid, elemonic acid, etc.) and diamines (such as ethylenediamine, propylene diamine, hexamethylene diamine). Amine formation. Obtained through condensation.
When synthesizing polyamide resin, different diamines are used to obtain resins with different molecular weights and softening points. The method of mixing ethylenediamine and hexamethylenediamine is commonly used.
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