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EVA hot melt adhesive has long been a favorite adhesive for customers, and there are good reasons for this. The main assets provided by these multifunctional adhesives are:

Capable of bonding impermeable surfaces.
The ability to fill in gaps.
Easy to store.
Environmental protection.
To make the best use of EVA hot melt adhesive, please remember the following five important tips:
1. Ensure to check and follow the recommended temperature range for the adhesive used. Do not exceed the working temperature range of hot melt adhesive. Doing so will burn the adhesive, which can damage your dispensing equipment and render the hot melt adhesive useless for your project.
2. Please make sure to clean the substrate you are bonding. Hot melt adhesive does not stick to dust, so if you are dealing with dusty or dirty substrates, you are likely to damage the integrity of the bond.
If you use metal, please ensure that the metal surface is not greasy. (Some metals may leave greasy or greasy surfaces during the manufacturing process.) If so, clean the surface with a suitable solvent before using EVA hot melt adhesive.
Generally speaking, viscosity (the ability of hot melt adhesive to flow freely) is related to the temperature of the hot melt adhesive. The higher the temperature, the higher the viscosity. If the hot melt adhesive flows too slowly, gradually increase its temperature – but make sure you stay within the recommended working temperature range. The ordinary craft glue gun operates between 250 degrees and 400 degrees, and when it reaches the appropriate temperature, the flow is considered to be of medium to high viscosity. It takes about 15 seconds to harden.
5. Ensure that you are familiar with the type of hot melt adhesive you are using. Usually, EVA hot melt adhesive is very suitable for packaging and wood applications. Polyolefins are more specialized and are ideal for use with fabrics, metals and foam. Polyamide has high heat resistance and is commonly used in applications such as electrical potting and manufacturing circuit boards. Reactive hot melt adhesive has the highest tensile strength and heat resistance among all hot melt adhesives.
Direct answer: The smaller the particles, the faster they melt, but to a certain extent, it can lead to new problems such as clumping, clogging, and carbonization. For most book binding and sealing equipment, a standard particle size of 3-5mm is the most comprehensive and optimal, and blindly pursuing small particles is a typical misconception. […]
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