What are the common knowledge of hot melt glue in book binding?

In the rapidly developing binding industry, the requirements for book binding are also increasing day by day. Therefore, many binding factories choose high-quality, non drawing, and high bonding strength hot melt adhesives. High performance hot melt adhesive has also become an important guarantee for the quality of books. For example, Senlai book hot melt adhesive has the advantages of moderate fluidity, strong adhesion, few bubbles, no wire drawing, and good temperature resistance. The advantages of this hot melt adhesive are suitable for book binding on copperplate paper and adhesive paper.

What are the common knowledge of hot melt glue binding for books?

1. Choose the appropriate hot melt adhesive

In book binding, you can choose the appropriate hot melt adhesive according to your actual binding situation. Adhesive paper (such as workbooks, magazines, copperplate books, etc.) is used for book backs.

Secondly, temperature control is the key to ensuring book printing

During the use of book glue, the temperature of the hot melt adhesive should be controlled according to the workshop temperature and the product paper. The temperature inside the glue should be kept stable. During the bookbinding process, the temperature of the glue is mostly controlled between 140 ℃ and 170 ℃. The permeability and flowability of the glue are directly affected by the usage temperature. The higher the temperature, the better the fluidity and permeability of hot melt adhesive, but the strength will decrease when bonding books. If the high temperature persists for a long time, it will cause carbonization and decomposition of the glue, leading to aging and affecting the quality of book binding. On the contrary, when the temperature of hot melt adhesive is too low, the bonding strength increases, the flowability decreases, and the permeability of the adhesive weakens, thereby affecting the adhesion between the adhesive and the paper. This can easily cause the adhesive on the back of the book to be incomplete, uneven, and prone to falling, loose, and empty pages.

The use temperature of hot melt adhesive should be slightly adjusted according to the temperature range provided by the manufacturer, and the temperature should not be too high or too low during adjustment. Hot melt adhesive needs to be cooled down during summer, and vice versa during winter. Many bookbinding factories often stack the indoor temperature on the temperature control display to achieve their desired temperature, which is incorrect. The ambient temperature only affects the cooling rate of the adhesive on the product.

Thirdly, controlling the amount of glue is an important factor in shaping books

Controlling the amount of glue is related to the thickness of the glue applied to the back of the book, which will directly affect the bonding effect of the book. If the amount of glue is reduced and the coating becomes thinner, the glue cannot fully penetrate the back of the book, causing the bonding force of the hot melt adhesive to the paper to weaken, and the book is prone to falling pages; If the amount of glue applied is too much, the back glue may easily squeeze out and dirty the machine during cover printing, affecting the binding effect. So when applying glue, the amount of glue should be controlled well, adding less frequently or directly adding glue through a pre sol pot.