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Both new and existing users of hot melt packaging adhesive need to consider many factors when solving problems on the production line. The problem usually occurs in one of the following three aspects: equipment, adhesive, or environment. Any one or combination of these three variables could be the root cause of the problem.
Some common items to consider are:
Equipment:What are the equipment settings – applicator temperature, solenoid valve pressure, applicator position, and nozzle closure? The production line speed can be adjusted according to the packaging. It is important to check to ensure that the device settings are optimal for each application. If the substrate is too far from the nozzle tip, the adhesive may cool before being applied to the shell or cardboard box, causing it to accumulate due to wire drawing and other issues. In addition, if the temperature is too low, the viscosity of the packaging hot melt adhesive will increase the impact cutting of the nozzle and increase the drawing or stacking.
Environment: How is the production area set up and is there excessive airflow in the area? Two common issues are air circulation – fan or; HVAC – Refers directly to the cooler ambient air temperature in the packaging area and factory. Both will reduce the drying time of the adhesive and lead to wire drawing. Checking the airflow and production area temperature to ensure that there is not too much direct targeting towards specific application points can help speed up the setup time.
Adhesive:What are the properties of adhesive – viscosity and temperature?? Packaging hot melt adhesiveFormulated for different purposes..
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